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  1. TESSERA TECHNOLOGIES

    UBGA, 3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. Tessera ...

    global.tessera.com - 2009-04-09
  2. signal integrity, high speed, IR drop, substrate design, flip chip, cavity down, power integrity, CO design, reliability modeling, 3D package, 3D packaging, ...

    3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. broadpak produces ...
    cavity down0
    memory stacking0
    multi chip package0
    substrate design0

    www.broadpak.com - 2009-02-11

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